商品分类
品牌：
- NXP(恩智浦)
- ST(意法半导体)
- TI(德州仪器)
- JSMSEMI(杰盛微)
- FORSINVE(福芯微)
- FM(复旦微)
- WISESUN(维晟)
- 南京中科微
- KINGHELM(金航标)
- INFINEON(英飞凌)
- SKYWORKS
- ABRACON
- ZHHXDZ(海芯电子)
- NYFEA(徕飞)
- 杭州瑞盟
- NEXPERIA(安世)
- MICROCHIP(美国微芯)
- TOKMAS(托克马斯)
- HTCSEMI(海天芯)
- RENESAS(瑞萨)
- AMS(艾迈斯半导体)
- MOLEX
封装：
- QFN-32-EP(5X5)
- TSSOP-8
- SO-8
- HVQFN-32-EP(5X5)
- QFN-32
- HVQFN-40(6X6)
- UFDFPN-8(2X3)
- HVQFN-32(5X5)
- SOIC-8
- 32-VFQFN 裸露焊盘
- QFN-32(5X5)
- VFBGA-64
- HVQFN-40-EP(6X6)
- SO-14
- VQFN(RHB)|32
- HVQFN-64-EP(9X9)
- VFQFN-32L(5X5)
- VQFN-32-EP(5X5)
- XQFN-16(1.8X2.6)
- XQFN-8(1.6X1.6)
- SOP-8-150MIL
- TSSOP-8-3MM
- UFDFPN-12L(3X3)
- UFQFPN-32(5X5)
- 16-XFQFN
- 8-SO
- 8-TSSOP
- QFN-40-EP(6X6)
- UDFN-12-EP(3X3)
- UFDFN-5(1.4X1.7)
- UFDFN-8-EP(2X3)
- VQFN-40-EP(6X6)
- 12-UFDFPN(3X3)
- 3-XDFN
- 40-VFQFN 裸露焊盘
- UFQFPN-24(4X4)
- VQFN(RGE)|24
- WLCSP-36(3.2X3.2)
- 16-TSSOP(0.173",4.40MM 宽)
- 16-VFQFN 裸露焊盘
- 8-SOIC(0.154",3.90MM 宽)
- 8-XFQFN 裸露焊盘
- DFN-8(2X2)
- QFN
- QFN-16(3X3)
- RFIDG(TGA)|0
- SOP-16
- SOP-32-300MIL
- TFBGA-64
- TSSOP(PW)|14
- TSSOP-14
- TSSOP-20
- VFDFN-8(5X6)
- VFLGA-40
- VFQFN-32(5X5)
- VQFN(RGT)|16
- WFBGA-64
- WQFN-40-EP(6X6)
- 16-QFN(3X3)
- 20-QFN(3X3)
- 24-VFQFN 裸露焊盘
- 32-VFQFN EXPOSED PAD
- 32-VFQFN(5X5)
- 32-VQFN(5X5)
- 48-VFQFN 裸露焊盘
- 5-UFDFPN(1.7X1.4)
- 6-XFDFN
- 64-TFBGA
- 8-UFDFPN(2X3)
- 8-XQFN(1.6X1.6)
- DFN-8-EP(2X2)
- HTQFP-100
- HVQFN-16(3X3)
- HVQFN-56-EP(7X7)
- HXSON-4-EP(1.5X2)
- MSOP-8
- QFN-16
- QFN-16(4X4)
- QFN-16-EP(3X3)
- QFN-40(6X6)
- QFN32_5X5MM_EP
- RFIDGSUB(TGC)|0
- RFIDN(TFJ)|0
- RFIDPSUB(TEC)|0
- SMD-16P,4X4MM
- SOIC(D)|16
- SOIC-14
- SOIC-16
- SOIC-24-300MIL
- SOIC-32_300MIL
- SON-8
- TDFN-10-EP(3X3)
- TQFN-16-EP(3X3)
- TSSOP-16
- UDFN-8(2X3)
- UFDFPN-12 EPD [3.00 X 3.00 X 0.60 MM]
- UFQFPN-24-EP(4X4)
- UQFPN-32(5X5)
- VFQFN-32
- VFQFN32L_5X5MM
- VFQFPN-32L(5X5)
- VQFN(RSA)|16
- VQFN-48-EP(7X7)
- WLCSP-10(1.5X1.6)
- WLCSP-30(2.9X3.1)
- WQFN-20-EP(3X3)
- XCEPT(TRP)|0
- XSON-3
- XSON-6(1X1.5)
型号/品牌参数/描述库存批次价格阶梯(含税)数量操作